Aluminium nitride ceramic has the highest thermal conductivity of any ceramic material, as well as extremely good electrical insulation. This makes it the top-of-the-range choice for the most demanding of heat sink applications.
Aluminium nitride ceramic is stable up to 1000 °C in air and 1900 °C in inert atmospheres. The thermal expansion coefficient is lower than that of common heat sink materials such as aluminium and alumina. The thermal expansion coefficient is a close match to the expansion of common semiconductor substrate materials, making it ideal for the mounting of large semiconductor devices.
High thermal conductivity
High electrical insulation capacity
Low thermal expansion
Good metalization capacity
| Item | Unit | Technical Parameters |
| Purity | % | 95 |
| Color | – | Light Grey |
| Density | g/cm3 | ≥3.3 |
| Water Absorption | % | 0 |
| Moh’s Hardness | – | 8 |
| Flexural Strength | Mpa | 365-420 |
| Elasticity Modulus | Gpa | 310-320 |
| Thermal Conductivity | w/mk | ≥170 |
| Coefficient of Thermal Expansion (20~300℃) | 10-6/℃ | 4.6 |
| Melting Point | ℃ | 2500 |
| Volume Resistivity | Ω.cm | >1013 |
| Dielectric Constant (1MHz, 25℃) | – | 9 |
| Dielectric Loss (1MHz, 25℃) | – | 3.8×10-4 |
| Dielectric Strength | kv/mm | 17 |
The high temperatures present in semiconductor manufacturing processes combined with the sensitivity of the devices under fabrication make aluminium nitride particularly useful as a substrate material. Its high thermal conductivity allows it to act as an excellent heat sink while remaining electrically insulating and not fracturing under high temperatures. In addition, it has a very similar coefficient of thermal expansion to silicon.
AlN is a common alternative to beryllium oxide in similar applications, as it is not a health hazard when machined.
As a result of its high resistance to corrosion at high temperatures, AlN is also used as a crucible material for molten metals.
In the form of thin films, AlN has a number of applications. As a result of its piezoelectrical properties, it is used for surface acoustic wave (SAW) sensors. It is also used for thin film bar acoustic resonators (FBAR), a microelectromechanical system (MEMS) device used for RF filters in mobile phones. Research is also underway to develop gallium-aluminium nitride-based light-emitting diodes.
Some other common applications of AlN include:
Heat spreaders
Packages for microwave devices
Molten metal fixtures
Components for laser heat management
Electrical insulation components for lasers
Substrates for electronic packages
Substrates for microelectronic & optoelectronic devices
Insulators for microelectronic & optoelectronic devices
Chip carriers for sensors and detectors
Chiplets
Collets
Silicon wafer handling and processing
Electrical insulators
Chucks and clamp rings for semiconductor processing equipment
Steel manufacturing equipment
Our AIN ceramic are exported to USA, Canada, Europe, and South America and Southeast Asia.
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